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NTMS4706N
Power MOSFET
30 V, 10.3 A, Single N?Channel, SO?8
Features
? Low R DS(on)
? Low Gate Charge
? Standard SO?8 Single Package
? Pb?Free Package is Available
http://onsemi.com
Applications
? Notebooks, Graphics Cards
? Synchronous Rectification
? High Side Switch
? DC?DC Converters
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
V (BR)DSS
30 V
R DS(ON) TYP
9.0 m W @ 10 V
11.4 m W @ 4.5 V
N?Channel
I D MAX
(Note 1)
10.3 A
Parameter
Drain?to?Source Voltage
Gate?to?Source Voltage
Symbol
V DSS
V GS
Value
30
± 20
Unit
V
V
D
Continuous Drain
Current (Note 1)
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
8.6
6.2
A
G
t v 10 s
T A = 25 ° C
10.3
S
Power Dissipation
Steady
T A = 25 ° C
P D
1.5
W
(Note 1)
State
Continuous Drain
Current (Note 2)
t v 10 s
Steady
State
T A = 25 ° C
T A = 85 ° C
I D
2.2
6.4
4.6
A
MARKING DIAGRAM/
PIN ASSIGNMENT
1 8
Power Dissipation
(Note 2)
Pulsed Drain Current
T A = 25 ° C
t p = 10 m s
P D
I DM
0.83
31
W
A
1
SO?8
Source
Source
Source
Gate
Drain
Drain
Drain
Drain
Operating Junction and Storage Temperature
T J ,
T stg
?55 to
150
° C
CASE 751
STYLE 12
Top View
Source Current (Body Diode)
Single Pulse Drain?to?Source Avalanche Energy
(V DD = 25 V, V GS = 10 V, I L Peak = 7.5 A,
L = 10 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
I S
E AS
T L
2.1
150
260
A
mJ
° C
4706N = Device Code
A = Assembly Location
L = WaferLot
Y = Year
WW = Work Week
G = Pb?Free Package
THERMAL RESISTANCE MAXIMUM RATINGS
(Note: Microdot may be in either location)
Parameter
Symbol
Value
Unit
ORDERING INFORMATION
R q JA
Junction?to?Ambient – Steady State (Note 1) R q JA 83.5 ° C/W
Junction?to?Ambient – t v 10 s (Note 1) R q JA 58
Junction?to?Ambient – Steady State (Note 2) 150
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
Device
NTMS4706NR2
NTMS4706NR2G
Package
SO?8
SO?8
(Pb?Free)
Shipping ?
2500/Tape & Reel
2500/Tape & Reel
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surfacemounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2. Surfacemounted on FR4 board using the minimum recommended pad size.
*For additional information on our Pb?Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
? Semiconductor Components Industries, LLC, 2005
November, 2005 ? Rev. 3
1
Publication Order Number:
NTMS4706N/D
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